These high performance, particle deposition systems feature the most advanced particle atomization, electrostatic classification, and deposition technology for creating highly accurate PSL (polystyrene latex size standards for calibrating KLA-Tencor, Applied Materials, TopCon, Hitachi, and ADE wafer inspection systems.
They can also deposit mono-dispersed process particles on wafers to create WET Bench Particle Standards to challenge the cleaning efficiency of WET Clean benches.
Cleaning efficiency improvements of 3.0% to 10% are achievable for cleaning systems with these advanced particle deposition tools creating a superb ROI. Uniform sized process particles of SiO2, Al2O3, TiO2, Si3N4, Si, Ti, W, Ta, Cu, etc. can be deposited on wafers to provide particle on wafer adhesion so wafer cleaning tools can be realistically evaluated.
Both the 2300 XP1 and XP2 systems feature recipe control and automatic multi-spot and multi-size deposition.
Wafer loading and unloading is manual with the XP1.
The XP2 features fully automatic operation from 200mm open cassette. The 2300 XP3 is devoted to 300mm FOUP applications in support of metrology and Wet Bench applications with hands-off, fully automatic operation.
High resolution, NIST (National
Institute of Standards and Technology) traceable DMA sizing and
classification exceed the new SEMI Standards M53 protocol for
PSL size accuracy and size distribution width.
Advanced Differential Mobility Analyzer (DMA) technology
featuring automatic temperature and pressure compensation for
improved system stability and measurement accuracy.
Calendar PM alerts to flat-panel display (FPD)
to remind operator that maintenance is required.
User-friendly recipe-controlled software
Automatic deposition process provides multiple-spot
deposition on one wafer, followed by self-clean and purge.
Automatic nozzle positioning and wafer rotation
allows a variety of deposition shapes to be created: multiple
spot, ring-shaped, full-wafer deposition, and other custom-shapes.
Automatic wafer handling provides fast, hands-free,
computer handling for 200 mm and 300 mm wafers.
Full Wafer Depositions and Spot Wafer Depositions at any location on the wafer.
Four sonicating atomizers keep PSL spheres and
process particles suspended in solution for effective and rapid
deposition of up to 8 different PSL sizes and four different process
particle materials in a single setup
High sensitivity permitting PSL sphere and process
particle deposition from 80nm to 1um, optionally from 30nm to 2um or 20nm to 2um.
Deposit process particle on wafers to provide realistic
adhesion between particle and wafer surface for cleaning process
development andcleaning system improvement to increase efficiency
Deposit PSL spheres on wafers to create calibration
standards for KLA-Tencor, Applied Materials, TopCon, Hitachi,
and ADE wafer inspection systems.
Deposit PSL spheres and process particles on bare,
film-layered, and patterned wafer to study influence of wafer
surface, and particle refractive index on optical response of
wafer inspection systems.