Particle Wafer Standards

Particle Deposition is used to deposit PSL spheres and silica particles on 150mm to 300mm wafers for size calibration of KLA-Tencor Surfscan SSIS tools.

PSL Wafer Standards and Silica Particle Wafer Standards are produced with a Particle Deposition System, which will first analyze a PSL size peak or silica size peak with a Differential Mobility Analyzer (DMA). A DMA is a highly accurate particle scanning tool, combined with condensation particle counter and computer control to isolate a highly accurate size peak, based on NIST Traceable particle size calibration. Once the size peak is verified, the particle size stream is directed to the prime silicon, wafer standard surface; counted as it is deposited in a full deposition across the wafer, or as a spot deposition at specific locations around the wafer. Wafer standards are highly accurate in particle size for calibration of KLA-Tencor Surfscan SP1, KLA-Tencor Surfscan SP2, KLA-Tencor Surfscan SP3, KLA-Tencor Surfscan SP5, Surfscan SPx, Tencor 6420, Tencor 6220, Tencor 6200, ADE, Hitachi and Topcon SSIS tools and wafer inspection systems. – The 2300 XP1 Particle Deposition System can deposit on 150mm, 200mm and 300mm wafers using PSL Spheres or silica particles from 30nm to 2um.

Differential Mobility Analyzer, DMA Voltage scan, Silica Size Peak, 100nm
Differential Mobility Analyzer, DMA Voltage, Silica size peak at 100nm
PSL Spheres size standards and silica size standards are scanned by a differential mobility analyzer to determine true size peak. Once the size peak is analyzed, then the wafer standard can be deposited as a full deposition or a spot deposition, or a multiple spot deposition wafer standards. Silica size peak at 100 nano meters (0.1 microns) is scanned above and the DMA detects a true silica size peak at 101nm.

Full Deposition or Spot Deposition Wafer Standards

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A particle deposition system provides highly accurate, PSL Calibration Wafer Standards and Silica Contamination Wafer Standards.

Our 2300 XP1 Particle Deposition System provides automatic particle deposition control to produce your PSL Wafer Standards and Silica Wafer Standards.

Particle Deposition Applications
High resolution, NIST traceable DMA (differential mobility analyzer) sizing and classification exceed the new SEMI Standards M52, M53 and M58 protocol for PSL size accuracy and size distribution width
Automatic deposition size calibration at 60nm, 100nm, 269nm and 900nm
Advanced Differential Mobility Analyzer (DMA) technology featuring automatic temperature and pressure compensation for improved system stability and measurement accuracy
Automatic deposition process provides multiple spot depositions on one wafer
Full Wafer Depositions across the wafer; or Spot Depositions at any location on the wafer
High sensitivity permitting PSL sphere and silica particle deposition from 20nm to 2um
Deposit silica particles for calibration of your wafer inspection systems using high powered laser scanning
Deposit PSL spheres for calibration of your wafer inspection systems using low powered laser scanning
Deposit PSL spheres and silica particles on prime silicon wafer standards, or your 150mm photo masks.

PSL Calibration Wafer Standard, Silica Contamination Wafer Standard
Particle Deposition tools are used to deposit a very accurate PSL size standard or silica particle size standard on the wafer standard to calibrate a variety of wafer inspection systems.

PSL Calibration Wafer Standard for calibration of wafer inspection systems using a low powered laser to scan wafers.
Silica Contamination Wafer Standard for calibration of wafer inspection systems using a high powered laser to scan wafers.
Calibration Mask Standard or Silica Mask Standard
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Our 2300 XP1 deposits NIST Traceable, Certified mask Standards on 125mm and 150mm borosilicate masks.

PSL Calibration Mask Standard on 125mm masks
Silica Contamination Standard on 150mm masks