Microscopic Particle Detection Challenges in 3D NAND Scaling
The semiconductor industry has successfully bypassed the physical scaling limitations of planar (2D) NAND flash memory by moving into the vertical dimension. 3D NAND technology relies on stacking alternating thin films of materials, typically insulating oxide ($\text{SiO}_2$) and sacrificial nitride ($\text{Si}_3\text{N}_4$) layers on top of a silicon substrate. Through a series of advanced photolithography, deep […]
