Description
Particle Deposition is used to deposit PSL spheres and silica particles on 150mm to 300mm wafers for size calibration of KLA-Tencor Surfscan SSIS tools. PSL Wafer Standards and Silica Particle Wafer Standards are produced with a Particle Deposition System, which will first analyze a PSL size peak or silica size peak with a Differential Mobility Analyzer (DMA). A DMA is a highly accurate particle scanning tool, combined with condensation particle counter and computer control to isolate a highly accurate size peak, based on NIST Traceable particle size calibration. Once the size peak is verified, the particle size stream is directed to the prime silicon, wafer standard surface; counted as it is deposited in a full deposition across the wafer, or as a spot deposition at specific locations around the wafer. Wafer standards are highly accurate in particle size for calibration of KLA-Tencor Surfscan SP1, KLA-Tencor Surfscan SP2, KLA-Tencor Surfscan SP3, KLA-Tencor Surfscan SP5, Surfscan SPx, Tencor 6420, Tencor 6220, Tencor 6200, ADE, Hitachi and Topcon SSIS tools and wafer inspection systems. – The 2300 XP1 Particle Deposition System can deposit on 150mm, 200mm and 300mm wafers using PSL Spheres or silica particles from 30nm to 2um. Differential Mobility Analyzer, DMA Voltage scan, Silica Size Peak, 100nm Differential Mobility Analyzer, DMA Voltage, Silica size peak at 100nm PSL Spheres size standards and silica size standards are scanned by a differential mobility analyzer to determine true size peak. Once the size peak is analyzed, then the wafer standard can be deposited as a full deposition or a spot deposition, or a multiple spot deposition wafer standards. Silica size peak at 100 nano meters (0.1 microns) is scanned above and the DMA detects a true silica size peak at 101nm. Full Deposition or Spot Deposition Wafer Standards REQUEST A QUOTE A particle deposition system provides highly accurate, PSL Calibration Wafer Standards and Silica Contamination Wafer Standards. Our 2300 XP1 Particle Deposition System provides automatic particle deposition control to produce your PSL Wafer Standards and Silica Wafer Standards. Particle Deposition Applications High resolution, NIST traceable DMA (differential mobility analyzer) sizing and classification exceed the new SEMI Standards M52, M53 and M58 protocol for PSL size accuracy and size distribution width Automatic deposition size calibration at 60nm, 100nm, 269nm and 900nm Advanced Differential Mobility Analyzer (DMA) technology featuring automatic temperature and pressure compensation for improved system stability and measurement accuracy Automatic deposition process provides multiple spot depositions on one wafer Full Wafer Depositions across the wafer; or Spot Depositions at any location on the wafer High sensitivity permitting PSL sphere and silica particle deposition from 20nm to 2um Deposit silica particles for calibration of your wafer inspection systems using high powered laser scanning Deposit PSL spheres for calibration of your wafer inspection systems using low powered laser scanning Deposit PSL spheres and silica particles on prime silicon wafer standards, or your 150mm photo masks. PSL Calibration Wafer Standard, Silica Contamination Wafer Standard Particle Deposition tools are used to deposit a very accurate PSL size standard or silica particle size standard on the wafer standard to calibrate a variety of wafer inspection systems. PSL Calibration Wafer Standard for calibration of wafer inspection systems using a low powered laser to scan wafers. Silica Contamination Wafer Standard for calibration of wafer inspection systems using a high powered laser to scan wafers. Calibration Mask Standard or Silica Mask Standard REQUEST A QUOTE Our 2300 XP1 deposits NIST Traceable, Certified mask Standards on 125mm and 150mm borosilicate masks. PSL Calibration Mask Standard on 125mm masks Silica Contamination Standard on 150mm masks
Particle Wafer Standards
Configure the reference wafer around the SSIS recipe—not a generic compatibility claim
The quotation should lock the exact wafer and particle configuration to the intended inspection workflow.
Wafer
Specify diameter, substrate/material and surface requirements.
Particles
Specify PSL, silica or other requested material, nominal size or size set.
Deposition
Specify full-wafer or controlled spot deposition and any repeatable pattern/location requirement.
Reference Selection
PSL wafer, silica contamination wafer, or particle standard?
| Customer objective | Start with | Critical RFQ variables |
|---|---|---|
| Verify SSIS particle-size response | PSL calibration wafer | Tool/model, wafer, nominal size(s), full vs spot, recipe/SOP |
| Evaluate repeatability / scan response across wafer | Full-deposition calibration wafer | Wafer diameter/substrate, target peak, scan objective |
| Use a non-PSL / silica reference | Silica contamination wafer | Optical method, substrate, size(s), deposition geometry |
| Develop or verify a particle-reference workflow off-wafer | Particle size standard | Material, nominal size, concentration/form, instrument, certificate need |
| Compound semiconductor / SiC / GaN inspection | Configuration review first | Tool/model, substrate, diameter, surface/epi state, channel/recipe objective, reference material |
Send these five items with the RFQ
- Exact inspection tool / model and recipe objective
- Wafer diameter and substrate/material
- Particle material: PSL, silica or other
- Nominal particle size or multi-size set
- Full-wafer vs. spot deposition and pattern/location
Why this matters
A model name such as Surfscan SP5, SP7 or SP2 does not uniquely determine the correct standard. Sensitivity mode, substrate, recipe and calibration objective can change the useful reference configuration.
For quoting: include any internal SOP/specification number and whether the standard is for initial calibration, periodic verification, recipe development or troubleshooting.
RFQ Conversion Checklist
Send a quote-ready wafer-standard request
- Inspection tool manufacturer and exact model
- Wafer diameter, substrate/material and surface/film condition
- PSL, silica or other requested reference material
- Nominal particle size(s) and single- or multi-peak requirement
- Full or spot deposition, location/pattern and recipe/SOP objective
What AP should return
- Recommended reference configuration
- Any compatibility assumptions requiring customer confirmation
- Certificate / traceability scope
- Lead time and commercial quote
Use the product quote control. Your selected product, variation and quantity will remain attached to the request while you add application and technical details.
Technical FAQ
Questions engineers and validation teams ask
Product relationship
Applied Physics Manufactured Product
This product is part of an Applied Physics product line. Applied Physics is the product brand and manufacturer. Model-specific specifications and engineering documentation on this page remain authoritative.
Applied Physics portfolio: Semiconductor
CUSTOM PARTICLE WAFER
Lock the wafer, particles and deposition into one specification
Wafer geometrySurface or film conditionParticle materialSize or multi-size setPattern and location
A useful quotation identifies the entire reference configuration and the inspection objective. A tool-family name alone is not enough to establish suitability.
Product family: Semiconductor Metrology › Wafer Standards › Particle Wafer StandardsCatalog relationship: Applied Physics Manufactured Product
Related Applied Physics resources
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Use these technical and portfolio pages to compare applications and related equipment. To keep this exact product attached to an RFQ, use the product’s existing Request a Quote or Add To Order control.
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