Particle Wafer Standards

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Particle Deposition is used to deposit PSL spheres and silica particles on 150mm to 300mm wafers for size calibration of KLA-Tencor Surfscan SSIS tools.
PSL Wafer Standards and Silica Particle Wafer S…

CUSTOM PARTICLE WAFER

Lock the wafer, particles and deposition into one specification

Wafer geometrySurface or film conditionParticle materialSize or multi-size setPattern and location

A useful quotation identifies the entire reference configuration and the inspection objective. A tool-family name alone is not enough to establish suitability.

SKU: AP-PARTICLE-WAFER-STD Categories: , Tags: , , , Product family: Semiconductor Metrology › Wafer Standards › Particle Wafer StandardsCatalog relationship: Applied Physics Manufactured Product
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Description

Particle Deposition is used to deposit PSL spheres and silica particles on 150mm to 300mm wafers for size calibration of KLA-Tencor Surfscan SSIS tools.

PSL Wafer Standards and Silica Particle Wafer Standards are produced with a Particle Deposition System, which will first analyze a PSL size peak or silica size peak with a Differential Mobility Analyzer (DMA). A DMA is a highly accurate particle scanning tool, combined with condensation particle counter and computer control to isolate a highly accurate size peak, based on NIST Traceable particle size calibration. Once the size peak is verified, the particle size stream is directed to the prime silicon, wafer standard surface; counted as it is deposited in a full deposition across the wafer, or as a spot deposition at specific locations around the wafer. Wafer standards are highly accurate in particle size for calibration of KLA-Tencor Surfscan SP1, KLA-Tencor Surfscan SP2, KLA-Tencor Surfscan SP3, KLA-Tencor Surfscan SP5, Surfscan SPx, Tencor 6420, Tencor 6220, Tencor 6200, ADE, Hitachi and Topcon SSIS tools and wafer inspection systems. – The 2300 XP1 Particle Deposition System can deposit on 150mm, 200mm and 300mm wafers using PSL Spheres or silica particles from 30nm to 2um.

Differential Mobility Analyzer, DMA Voltage scan, Silica Size Peak, 100nm
Differential Mobility Analyzer, DMA Voltage, Silica size peak at 100nm
PSL Spheres size standards and silica size standards are scanned by a differential mobility analyzer to determine true size peak. Once the size peak is analyzed, then the wafer standard can be deposited as a full deposition or a spot deposition, or a multiple spot deposition wafer standards. Silica size peak at 100 nano meters (0.1 microns) is scanned above and the DMA detects a true silica size peak at 101nm.

Full Deposition or Spot Deposition Wafer Standards

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A particle deposition system provides highly accurate, PSL Calibration Wafer Standards and Silica Contamination Wafer Standards.

Our 2300 XP1 Particle Deposition System provides automatic particle deposition control to produce your PSL Wafer Standards and Silica Wafer Standards.

Particle Deposition Applications
High resolution, NIST traceable DMA (differential mobility analyzer) sizing and classification exceed the new SEMI Standards M52, M53 and M58 protocol for PSL size accuracy and size distribution width
Automatic deposition size calibration at 60nm, 100nm, 269nm and 900nm
Advanced Differential Mobility Analyzer (DMA) technology featuring automatic temperature and pressure compensation for improved system stability and measurement accuracy
Automatic deposition process provides multiple spot depositions on one wafer
Full Wafer Depositions across the wafer; or Spot Depositions at any location on the wafer
High sensitivity permitting PSL sphere and silica particle deposition from 20nm to 2um
Deposit silica particles for calibration of your wafer inspection systems using high powered laser scanning
Deposit PSL spheres for calibration of your wafer inspection systems using low powered laser scanning
Deposit PSL spheres and silica particles on prime silicon wafer standards, or your 150mm photo masks.

PSL Calibration Wafer Standard, Silica Contamination Wafer Standard
Particle Deposition tools are used to deposit a very accurate PSL size standard or silica particle size standard on the wafer standard to calibrate a variety of wafer inspection systems.

PSL Calibration Wafer Standard for calibration of wafer inspection systems using a low powered laser to scan wafers.
Silica Contamination Wafer Standard for calibration of wafer inspection systems using a high powered laser to scan wafers.
Calibration Mask Standard or Silica Mask Standard
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Our 2300 XP1 deposits NIST Traceable, Certified mask Standards on 125mm and 150mm borosilicate masks.

PSL Calibration Mask Standard on 125mm masks
Silica Contamination Standard on 150mm masks

Particle Wafer Standards

Configure the reference wafer around the SSIS recipe—not a generic compatibility claim

The quotation should lock the exact wafer and particle configuration to the intended inspection workflow.

Wafer

Specify diameter, substrate/material and surface requirements.

Particles

Specify PSL, silica or other requested material, nominal size or size set.

Deposition

Specify full-wafer or controlled spot deposition and any repeatable pattern/location requirement.

Reference Selection

PSL wafer, silica contamination wafer, or particle standard?

Customer objectiveStart withCritical RFQ variables
Verify SSIS particle-size responsePSL calibration waferTool/model, wafer, nominal size(s), full vs spot, recipe/SOP
Evaluate repeatability / scan response across waferFull-deposition calibration waferWafer diameter/substrate, target peak, scan objective
Use a non-PSL / silica referenceSilica contamination waferOptical method, substrate, size(s), deposition geometry
Develop or verify a particle-reference workflow off-waferParticle size standardMaterial, nominal size, concentration/form, instrument, certificate need
Compound semiconductor / SiC / GaN inspectionConfiguration review firstTool/model, substrate, diameter, surface/epi state, channel/recipe objective, reference material

Send these five items with the RFQ

  1. Exact inspection tool / model and recipe objective
  2. Wafer diameter and substrate/material
  3. Particle material: PSL, silica or other
  4. Nominal particle size or multi-size set
  5. Full-wafer vs. spot deposition and pattern/location

Why this matters

A model name such as Surfscan SP5, SP7 or SP2 does not uniquely determine the correct standard. Sensitivity mode, substrate, recipe and calibration objective can change the useful reference configuration.

For quoting: include any internal SOP/specification number and whether the standard is for initial calibration, periodic verification, recipe development or troubleshooting.

RFQ Conversion Checklist

Send a quote-ready wafer-standard request

  1. Inspection tool manufacturer and exact model
  2. Wafer diameter, substrate/material and surface/film condition
  3. PSL, silica or other requested reference material
  4. Nominal particle size(s) and single- or multi-peak requirement
  5. Full or spot deposition, location/pattern and recipe/SOP objective

What AP should return

  • Recommended reference configuration
  • Any compatibility assumptions requiring customer confirmation
  • Certificate / traceability scope
  • Lead time and commercial quote

Use the product quote control. Your selected product, variation and quantity will remain attached to the request while you add application and technical details.

Technical FAQ

Questions engineers and validation teams ask

What is a particle wafer standard?

A particle wafer standard is a silicon wafer with a controlled deposition of known reference particles, used to verify the response of wafer-inspection and SSIS systems.

Can particle wafer standards use PSL or silica?

Yes. Applied Physics offers wafer standards using PSL spheres or silica particles depending on the calibration objective and inspection platform.

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