Advanced Diagnostics for Thermal Non-Uniformity in Reflow Ovens
In Surface Mount Technology (SMT), the reflow soldering process is the most critical stage for ensuring electrical and mechanical integrity. As components become smaller (01005 and 008004 packages) and PCBs become more complex with varying copper weights, the margin for error in temperature control has vanished. Thermal non-uniformity, the variance in temperature across different points […]
