Description
The Applied Physics Semiconductor F840 Series 8 Zone Reflow Oven is engineered for high-precision, high-throughput SMT (Surface Mount Technology) production lines. Designed to meet the rigorous demands of modern electronics manufacturing, this advanced reflow oven features 8 upper and 8 lower heating zones, computer-controlled temperature management, and robust construction for reliable, repeatable results. The F840 Series is ideal for lead-free soldering processes and is optimized for both performance and energy efficiency, making it a top choice for PCB assembly operations in the United States and beyond.
Key Features
- 16 Independent Heating Zones: 8 upper and 8 lower zones for precise, uniform thermal profiles across the entire PCB.
- Advanced Forced Convection: Utilizes high-performance hot air circulation (Taiwan SAYA motors) for consistent temperature distribution and superior solder joint quality.
- Dual Cooling Zones: Equipped with 2 plasma DC fans for rapid, controlled cooling, minimizing thermal stress and ensuring optimal solder solidification.
- Wide PCB Compatibility: Supports PCB widths up to 400mm with a durable stainless steel mesh belt conveyor.
- Flexible Control Options: Choose between computer-controlled (F840-LF-C) and instrument-controlled (F840-LF) models to match your process requirements.
- Energy Efficient: Low power consumption (approx. 4–4.5KW during operation) and rapid warm-up time (15–20 minutes).
- Precision and Safety: ±2°C temperature control precision, real-time abnormal temperature alarms, and robust manual access for maintenance.
- US Market Ready: Designed to meet the highest standards for lead-free soldering and compliant with US industrial requirements.
Applications
- High-volume SMT PCB assembly
- Lead-free soldering processes
- Automotive, industrial, and consumer electronics manufacturing
- OEM and contract manufacturing environments
Technical Specifications
Below is a comprehensive specification table for the Applied Physics Semiconductor F840 Series 8 Zone Reflow Oven:
| Specification | F840-LF-C (Computer-Controlled) | F840-LF (Instrument-Controlled) |
| Heating Parts Parameters | ||
| Number of Heating Zones | Up 8 + Bottom 8 | Up 8 + Bottom 8 |
| Length of Heating Zones | 2840 mm | 2840 mm |
| Heating Pattern | Up: Hot air; Bottom: Hot air (Forced convection, Taiwan SAYA motor) | Up: Hot air; Bottom: Hot air (Forced convection, Taiwan SAYA motor) |
| Number of Cooling Zones | 2 Plasma DC Fan | 2 Plasma DC Fan |
| Conveyor Parts Parameters | ||
| Max. Width of PCB | 400 mm (stainless steel mesh belt) | 400 mm (stainless steel mesh belt) |
| Conveyor Direction | L → R | L → R |
| Conveyor Height | 880 ± 20 mm | 880 ± 20 mm |
| Transport Mode | Mesh Belt | Mesh Belt |
| Conveyor Speed Range | 0–2200 mm/min | 0–2200 mm/min |
| Control Parts Parameters | ||
| Power Supply | 5 Wire, 3 Phase, 380V 50/60Hz | 5 Wire, 3 Phase, 380V 50/60Hz |
| Start Power | 30 KW | 30 KW |
| Power Consumption | Approx. 4–4.5 KW | Approx. 4–4.5 KW |
| Warming Time | Approx. 15–20 mins | Approx. 15–20 mins |
| Temp. Setting Range | Room Temp. – 380°C | Room Temp. – 380°C |
| Temperature Control Method | Computer-controlled | Instrument-controlled |
| Temperature Difference Between Adjacent Zones | 70°C (supports the highest lead-free standards) | 70°C (supports the highest lead-free standards) |
| Temperature Control Precision | ±2°C | ±2°C |
| Temperature Deviation on PCB | ±2°C | ±2°C |
| Abnormal Alarm | Temperature abnormal (too high or too low after constant temperature keeping) | Temperature abnormal (too high or too low after constant temperature keeping) |
| Open Way | Manual | Manual |
| General Parameters | ||
| Dimension (L × W × H) | 4250 × 760 × 1450 mm | 4250 × 760 × 1450 mm |
| Weight | Approx. 500 kg | Approx. 500 kg |
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Why Choose the F840 Series from Applied Physics Semiconductor?
- Precision Engineering: Achieve consistent, high-quality solder joints with advanced temperature control and uniform heating.
- Process Flexibility: Adaptable for a wide range of PCB sizes and assembly requirements.
- Reliability: Built for demanding production environments with robust construction and proven components.
- US-Based Support: Backed by Applied Physics Semiconductor’s commitment to customer service, technical support, and rapid response for North American clients.
- Compliance and Safety: Designed to meet or exceed US and international standards for lead-free and high-reliability electronics manufacturing.
Product relationship
Available Through Applied Physics
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