Description
100 mm wafers bridge experimental and production applications. In R&D, they offer a cost-effective substrate for developing and validating new processes. In legacy production, they continue to support established process lines. Calibration standards at this size ensure that the SSIS tools inspecting these wafers produce accurate, reproducible data regardless of application. Key Applications
- Calibrate Inspection Tools: Size response curves for 100 mm SSIS tools are generated using known particle sizes. This calibration corrects for tool-specific optical characteristics, ensuring that a 0.5 µm PSL sphere registers as 0.5 µm regardless of minor tool-to-tool variation.
- Tool Qualification & Certification: Qual-Dep™ baselines document that a 100 mm inspection tool is operating within specification. This certification is typically required before a tool can be released for production use or after maintenance events.
- Research & Development: Dev-Dep™ standards allow process engineers to evaluate how new inspection recipes or technologies perform on 100 mm substrates before scaling to larger wafer sizes.
- Verify Cleaning Processes: PRE evaluation on 100 mm cleaning equipment helps determine optimal chemical concentrations, exposure times, and mechanical parameters. Over-processing wastes chemicals and accelerates tool wear; under-processing leaves defects that compromise yield.
Variation Guide
- Full Deposit: Complete surface coverage across the 100mm substrate. Used for comprehensive tool qualification where scan uniformity, optics alignment, and detector response across every radial zone must be verified.
- 1-Spot Deposit: Single-zone localized deposit. Ideal for rapid, targeted calibration checks, single-size recipe validation, or daily stability monitoring between full tool qualifications.
- 2-Spot Deposit: Two distinct deposition zones containing different particle sizes. Enables multi-point size-response calibration and dual-channel threshold verification in a single scan pass without requiring wafer swaps.
Technical Highlights
| Parameter | Specification |
| Wafer Diameter | 100 mm |
| Substrate | Prime silicon (flat or notch as required) |
| Particle Material | Polystyrene Latex (PSL) or Silica (SiO₂) – customer selectable |
| Particle Size Range | Typically 20 nm – several microns (exact sizes specified at order) |
| Deposit Options | Full Deposit, 1-Spot Deposit, or 2-Spot Deposit |
| Traceability | NIST-traceable with Certificate of Calibration |
| Compatibility | KLA-Tencor Surfscan SP1, SP2, SP3, SP5, SPx and equivalent SSIS platforms |
| Stability | Long-term stable deposits for consistent results over multiple calibration cycles |
Available with PSL spheres, SiO₂, or process particles, all NIST-traceable. These standards provide the reference data necessary for accurate defect sizing, consistent tool certification, and optimized cleaning processes on 100 mm platforms.
Product relationship
Available Through Applied Physics
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Applied Physics portfolio: Semiconductor
100 MM WAFER REFERENCE
Confirm the tool handling and substrate before particle deposition
100 mm waferExact inspection platformSubstrate and surfaceParticle sizeDeposition objective
Wafer diameter is one part of the specification. The particle material, size, deposition geometry and inspection recipe must also be defined for a quote-ready reference.
Catalog relationship: Available Through Applied Physics
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