Optimizing SMT Assembly with the T960 Infrared Reflow Oven
Surface Mount Technology (SMT) production lines face continuous pressure to deliver high board throughput while meeting strict lead-free soldering standards. As electronics designs incorporate larger substrates, such as long LED light bars, panelized arrays, and dense multi-layer circuit boards, maintaining flat, consistent temperature profiles across the entire assembly becomes critical. The T960 Lead-Free LED Infrared […]
