Surface Mount Technology (SMT) production lines face continuous pressure to deliver high board throughput while meeting strict lead-free soldering standards.
As electronics designs incorporate larger substrates, such as long LED light bars, panelized arrays, and dense multi-layer circuit boards, maintaining flat, consistent temperature profiles across the entire assembly becomes critical.
The T960 Lead-Free LED Infrared Reflow Oven directly targets these thermal and dimensional demands.
Combining a 4.5 kW power setup with an expansive 960 × 300 mm soldering area, this conveyorized reflow system provides smaller-to-medium scale manufacturing lines with reliable heat delivery and flexible power configurations.
Transitioning to lead-free solder pastes (such as SAC305 or Sn-Cu alloys) narrows the acceptable process window.
Lead-free alloys require higher liquidus temperatures, typically between 217°C and 220°C—and demand peak temperatures around 235°C to 245°C to ensure proper wetting without damaging temperature-sensitive ICs.
Standard benchtop reflow ovens often fall short when processing extended boards. The T960’s physical design solves two specific layout constraints common in SMT production.
Achieving repeatable solder joints requires setting appropriate belt speeds and temperature parameters across each stage of the process inside the T960.
The board enters the oven and steadily ramps up in temperature at a controlled rate (typically 1°C to 3°C per second).
This gradual rise prevents thermal shock to sensitive ceramic capacitors and prevents solder paste splattering caused by rapid solvent evaporation.
The temperature stabilizes between 150°C and 180°C. During this phase, flux chemistry activates to strip surface oxides from component leads and PCB copper pads, preparing the metal for bonding.
Temperatures cross the liquidus point of the solder paste.
The 4.5 kW heating output drives the peak chamber temperature to the required 235°C–245°C range for 30 to 60 seconds, allowing full solder wetting and intermetallic layer formation.
As the board exits the main heating tunnel, controlled air cooling quickly drops the temperature below the solidus point.
Rapid cooling forms a fine-grained solder microstructure, yielding stronger mechanical joints and bright surface finishes.
The T960 uses a hybrid heating arrangement, pairing radiant infrared heating elements with internal air circulation.
This balance helps minimize thermal shadowing under larger components like inductors, transformers, and quad-flat no-lead (QFN) packages while ensuring rapid ramp-up rates.
| Technical Parameter | Feature / Specification |
| Effective Soldering Area | 960 mm (Length) × 300 mm (Width) |
| Heating Power | 4.5 kW |
| Voltage Supply | 220V AC / 380V AC (Multi-phase compatible) |
| Heating Method | Far-Infrared Radiation + Forced Hot Air Convection |
| Maximum Operating Temp | Up to 300°C |
| Conveyor Type | Variable-Speed Stainless Steel Mesh Belt |
| Primary Applications | Lead-free SMT, long-format LED PCB assembly, small to medium production batches |
To keep the T960 running within calibrated tolerances.
The T960 Reflow Oven offers an effective blend of high thermal capacity, long working area, and lead-free profile control.
For assembly facilities handling standard SMT boards, dense prototypes, or continuous LED strip manufacturing, its 4.5 kW heating capability and 960 × 300 mm conveyor bed provide the stability necessary to maintain yield and defect-free solder joints.
Yes. The oven reaches internal temperatures up to 300°C, providing the thermal energy needed to run lead-free profiles with peak temperatures between 235°C and 245°C.
Yes. As long as bottom-side components are glued or held by surface tension (for smaller passives and ICs), double-sided boards can pass through using a calibrated bottom-zone thermal profile.
The T960 supports 220V single-phase or 380V multi-phase power connections to suit standard industrial facility outlets.
Pure infrared can create uneven heating due to dark components absorbing more heat than light ones. Forced air circulates heat evenly throughout the chamber, smoothing out color-based absorption differences across the PCB.
Since 1992, Applied Physics Corporation has been a leading global provider of precision contamination control and metrology standards. We specialize in airflow visualization, particle size standards, and cleanroom decontamination solutions for critical environments.
