Description
Applied Physics Semiconductor introduces the ZD-400 Solder Paste Mixer, engineered for precision, reliability, and ease of use in demanding electronics and semiconductor production environments. Designed to ensure optimal solder paste consistency, the ZD-400 delivers uniform mixing, temperature stabilization, and batch-to-batch repeatability—key for high-yield SMT and microelectronics assembly.
Key Features
- Dual-Can Mixing: Simultaneously mixes up to two 500g solder paste cans, maximizing throughput and efficiency.
- Digital Programmable Timer: Adjustable mixing time from 0.1 to 99 minutes, with fine-tuning in 0.1-minute increments for short cycles and 10-minute increments for longer cycles.
- High-Speed, Low-Noise Operation: Motor speed up to 1350 RPM with low operational noise (<20dB), ensuring a quiet production environment.
- Universal Fixture Design: Accommodates a wide range of solder paste can brands and sizes, including needle tube and red rubber tube formats.
- Safety Interlocks: Automatic stop when the upper cover is opened during operation, with restart capability after closure.
- User-Friendly Interface: Light-touch button operation and LED digital display for real-time status and time tracking.
- Robust Construction: Fully enclosed bearings (maintenance-free), durable build, and compact footprint for easy integration into any production line.
Technical Specifications
| Parameter | Specification |
| Model No. | ZD-400 |
| Mixing Capacity | 0–1000g × 2 cans (supports 500g solder paste cans) |
| Mixing Speed | Motor: 1350 RPM; Revolution: 1000 RPM; Rotation: 500 RPM |
| Time Setting | 0.1–9.9 min (0.1 min increments); 10–30 min (10 min increments); 1–99 min digital adjustable |
| Display Mode | LED digital display |
| Operation Mode | Light-touch button, programmable cycles |
| Fixture Compatibility | Universal fixture for various solder paste brands |
| Operation Noise | < 20 dB |
| Power Supply | AC 220V, 50/60Hz, >60W |
| Dimensions (L×W×H) | 400 × 400 × 420 mm |
| Machine Weight | 35 kg |
| Simultaneous Mixing | 2 cans (up to 500g each) |
| Safety Features | Automatic stop on cover open, restart after closure |
| Maintenance | Fully enclosed, maintenance-free bearings |
Operation Overview
- Loading: Place up to two solder paste cans (up to 500g each) into the universal fixture. Ensure the weight difference between cans does not exceed 100g, which will help prevent vibration during high-speed mixing.
- Programming: Set the desired mixing time using the digital control panel. The LED display will provide real-time feedback.
- Mixing: Press the start button. The operation indicator lights up, and the mixer starts stirring at high speed. The machine automatically stops at the end of the cycle, displaying the actual mixing time.
- Unloading: Once mixing is complete and the machine has stopped, open the upper cover and remove the cans. The solder paste is now temperature-stabilized and homogenized for immediate use.
- Safety: The mixer will automatically stop if the upper cover is opened during operation. To resume, close the cover and press the start button again.
- Shutdown: Turn off the power switch after production is finished.
Maintenance Guidelines
- Keep the machine clean and free of debris.
- Regularly check for loose screws and ensure all fasteners are secure.
- Verify the sensitivity and alignment of the machine switch and upper cover before each operation.
- No lubrication is needed or required for the fully enclosed bearings.
Why Choose the Applied Physics Semiconductor Solder Paste Mixer?
- Consistent Results: Achieve uniform solder paste viscosity and composition, critical for high-quality soldering and printing.
- Productivity: Mix two cans simultaneously, reducing downtime and increasing throughput.
- Safety and Reliability: Built-in safety interlocks and robust construction for worry-free operation.
- Universal Compatibility: Flexible fixture design supports a wide range of solder paste containers and brands.
- Quiet Operation: Low noise output ensures a comfortable working environment.
- Easy Integration: Compact size and simple controls make it the ideal choice for any electronics or semiconductor production line.
Applications
- Surface Mount Technology (SMT) assembly lines
- Semiconductor packaging and assembly
- Microelectronics manufacturing
- R&D and prototyping labs
- Any process requiring precise, homogeneous solder paste preparation
Product relationship
Available Through Applied Physics
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