Description
SMT Solder Paste Printing Machine
Applied Physics Semiconductor proudly presents its advanced SMT Solder Paste Printing Machine, engineered to deliver exceptional precision, speed, and reliability for modern electronics manufacturing. Designed to accommodate a wide range of PCB sizes and production requirements, this solution reflects our commitment to innovation and quality in every detail.
Technical Parameters
| Parameter | Specification |
| Maximum Board Size (X × Y) | 450mm × 350mm |
| Minimum Board Size (X × Y) | 50mm × 50mm |
| PCB Thickness | 0.4mm ~ 6mm |
| Warpage | ≤1% Diagonal |
| Maximum Board Weight | 3kg |
| Transfer Speed | 1500mm/s (Max) |
| Transfer Height from Ground | 900 ± 40mm |
| Transfer Orbit Direction | L-R, R-L, L-L, R-R |
| Transfer Mode | One stage orbit |
| Machine Weight | 800kg |
| External Dimensions | 1134mm × 1366mm × 1470mm |
| Field of View | 8mm × 6mm |
Key Advantages
- Versatile Board Handling: Supports a broad range of PCB sizes and thicknesses, making it ideal for diverse production needs.
- High-Speed Transfer: Achieves rapid board transfer speeds up to 1500mm/s, optimizing throughput for high-volume manufacturing.
- Precision Engineering: Maintains board flatness with ≤1% diagonal warpage tolerance, ensuring consistent print quality.
- Flexible Integration: Multiple transfer orbit directions (L-R, R-L, L-L, R-R) for seamless integration into any SMT production line layout.
- Robust Construction: Heavy-duty frame and optimized footprint for stability and reliability in demanding environments.



