[annasta_filters preset_id=1]

PCB Making LED DOB Assembly Production Line CHM LS08 Visual Mounter 8 Head Speed SMT Pick and Place Machine

If your production demands a high-speed, high-precision, and stable pick and place machine, the LS08 from Applied Physics Semiconductor is your ideal solution. Designed for cost-effectiveness and intelligent automation, the LS08 is engineered to optimize your SMT production line—whether for LED, DOB, or general PCB assembly. 

Key Advantages: 

  • Automatic Nozzle Change (ANC): 20-hole nozzle library enables the system to automatically allocate and change nozzles based on component type, making SMT production smarter and more efficient. 
  • Universal High-Precision Mounting Head: One machine meets the mounting needs of a wide range of components with exceptional stability. 
  • Cast Iron Base Structure: Ensures smooth, vibration-free operation at high speeds. 
  • Dual Servo Motor Drive: Guarantees mounting accuracy and long-term reliability. 
  • Advanced Vision System: High-definition IC camera and high-speed fly cameras for precise component recognition and placement verification. 

 

Why Choose Applied Physics Semiconductor? 

  • Trusted by Industry Leaders: Serving customers across North America and globally. 
  • Comprehensive SMT Solutions: From pick and place machines to solder paste printers and reflow ovens, plus one-stop SMT services. 
  • Expert Technical Support: Professional after-sales service and technical guidance. 
  • Customizable Production Lines: Tailored solutions for your unique manufacturing needs. 
  • Fast Delivery: Most products ship within 15 days of order confirmation. 

 

LS08 Technical Specifications 

Parameter Specification 
Dimensions 1280mm (L) × 1580mm (W) × 1500mm (H) 
Weight 1400 kg 
Power Supply AC220V (50Hz, single phase), 3.5kW 
Air Supply 0.5 MPa ~ 0.7 MPa 
Vacuum Generation Built-in vacuum pump 
Mounting Head Quantity 8 
Optimal Mounting Speed 35,000 components per hour (CPH) 
Mounting Accuracy (XY) ±0.035mm 
Component Height ≤20mm 
Component Types Supported 01005, 0201, 0402, 0603 up to 5050, SOT, SOP, QFP, QFN, BGA, resistors, capacitors, diodes, transistors, LEDs, ICs, etc. 
PCB Thickness 0.6mm ~ 3.5mm 
PCB Size (Standard) 450mm (L) × 350mm (W) 
PCB Size (Optional) 1200mm (L) × 350mm (W) 
PCB Conveying 3-section rail, automatic conveying, PCB support device 
Nozzle Change Automatic, 20-hole nozzle library 
Control System Built-in industrial computer (Windows 7), monitor, keyboard, mouse 
Drive System X & Y axes: servo motors (Y axis dual motors), S-curve acceleration 
Transmission System X & Y axes: ground screw and silent linear guides (Y axis dual screws) 
Feeding System 25 NXT 8mm standard feeder stacks (supports IC tray and stick feeder) 
Vision System 8 fly cameras (up to 16mm × 16mm components), 1 IC camera (up to 36mm × 36mm), 2 mark cameras 

Export as CSV 

 

Intelligent Automation & Advanced Features 

  • Automatic Nozzle Change (ANC): The LS08’s 20-hole nozzle library allows for seamless, automated nozzle changes, boosting efficiency and reducing manual intervention. 
  • Universal Mounting Head: Supports a wide range of component sizes (0201–16mm x 16mm and larger), eliminating the need for head replacement. 
  • Dual Servo Motor Y-Axis Drive: Ensures high-speed stability and accuracy, minimizing wear and maximizing uptime. 
  • Robust Frame Structure: Integrally cast iron base and Y-axis gantry provide superior impact resistance and long-term durability. 
  • Advanced Vision System: High-definition IC camera and high-speed fly cameras enable real-time, high-precision component recognition and placement verification. 
  • Flexible Feeding Options: Electric feeders with ±0.03mm accuracy, vibration feeders for tubular components, and IC tray support for bulk and tray-fed components. 

 

Complete SMT Line Integration 

Applied Physics Semiconductor offers a full suite of SMT production equipment, including: 

  • PCB Loaders & Unloaders: Automated board handling for seamless line integration. 
  • Solder Paste Printers: High-precision paste application for reliable solder joints. 
  • SMT Conveyors: Efficient board transfer between line segments. 
  • AOI (Automatic Optical Inspection): High-speed, high-precision inspection for mounting and soldering defects. 
  • Reflow Ovens: 8-zone temperature control for optimal soldering profiles. 
  • Feeders: Tape, tube, and tray feeders for all packaging types.