Description
If your production demands a high-speed, high-precision, and stable pick and place machine, the LS08 SMT Pick and Place Machine from Applied Physics Semiconductor is your ideal solution. Designed for cost-effectiveness and intelligent automation, the LS08 is engineered to optimize your SMT production line—whether for LED, DOB, or general PCB assembly.
Key Advantages:
- Automatic Nozzle Change (ANC): 20-hole nozzle library enables the system to automatically allocate and change nozzles based on component type, making SMT production smarter and more efficient.
- Universal High-Precision Mounting Head: One machine meets the mounting needs of a wide range of components with exceptional stability.
- Cast Iron Base Structure: Ensures smooth, vibration-free operation at high speeds.
- Dual Servo Motor Drive: Guarantees mounting accuracy and long-term reliability.
- Advanced Vision System: High-definition IC camera and high-speed fly cameras for precise component recognition and placement verification.
Why Choose Applied Physics Semiconductor?
- Trusted by Industry Leaders: Serving customers across North America and globally.
- Comprehensive SMT Solutions: From pick and place machines to solder paste printers and reflow ovens, plus one-stop SMT services.
- Expert Technical Support: Professional after-sales service and technical guidance.
- Customizable Production Lines: Tailored solutions for your unique manufacturing needs.
- Fast Delivery: Most products ship within 15 days of order confirmation.
LS08 Technical Specifications
| Parameter |
Specification |
| Dimensions |
1280mm (L) × 1580mm (W) × 1500mm (H) |
| Weight |
1400 kg |
| Power Supply |
AC220V (50Hz, single phase), 3.5kW |
| Air Supply |
0.5 MPa ~ 0.7 MPa |
| Vacuum Generation |
Built-in vacuum pump |
| Mounting Head Quantity |
8 |
| Optimal Mounting Speed |
35,000 components per hour (CPH) |
| Mounting Accuracy |
(XY) ±0.035mm |
| Component Height |
≤20mm |
| Component Types Supported |
01005, 0201, 0402, 0603 up to 5050, SOT, SOP, QFP, QFN, BGA, resistors, capacitors, diodes, transistors, LEDs, ICs, etc. |
| PCB Thickness |
0.6mm ~ 3.5mm |
| PCB Size (Standard) |
450mm (L) × 350mm (W) |
| PCB Size (Optional) |
1200mm (L) × 350mm (W) |
| PCB Conveying |
3-section rail, automatic conveying, PCB support device |
| Nozzle Change |
Automatic, 20-hole nozzle library |
| Control System |
Built-in industrial computer (Windows 7), monitor, keyboard, mouse |
| Drive System |
X & Y axes: servo motors (Y axis dual motors), S-curve acceleration |
| Transmission System |
X & Y axes: ground screw and silent linear guides (Y axis dual screws) |
| Feeding System |
25 NXT 8mm standard feeder stacks (supports IC tray and stick feeder) |
| Vision System |
8 fly cameras (up to 16mm × 16mm components), 1 IC camera (up to 36mm × 36mm), 2 mark cameras |
Export as CSV
Intelligent Automation & Advanced Features
- Automatic Nozzle Change (ANC): The LS08’s 20-hole nozzle library allows for seamless, automated nozzle changes, boosting efficiency and reducing manual intervention.
- Universal Mounting Head: Supports a wide range of component sizes (0201–16mm x 16mm and larger), eliminating the need for head replacement.
- Dual Servo Motor Y-Axis Drive: Ensures high-speed stability and accuracy, minimizing wear and maximizing uptime.
- Robust Frame Structure: Integrally cast iron base and Y-axis gantry provide superior impact resistance and long-term durability.
- Advanced Vision System: High-definition IC camera and high-speed fly cameras enable real-time, high-precision component recognition and placement verification.
- Flexible Feeding Options: Electric feeders with ±0.03mm accuracy, vibration feeders for tubular components, and IC tray support for bulk and tray-fed components.
Complete SMT Line Integration
Applied Physics Semiconductor offers a full suite of SMT production equipment, including:
- PCB Loaders & Unloaders: Automated board handling for seamless line integration.
- Solder Paste Printers: High-precision paste application for reliable solder joints.
- SMT Conveyors: Efficient board transfer between line segments.
- AOI (Automatic Optical Inspection): High-speed, high-precision inspection for mounting and soldering defects.
- Reflow Ovens: 8-zone temperature control for optimal soldering profiles.
- Feeders: Tape, tube, and tray feeders for all packaging types.
