Description
If your production demands a high-speed, high-precision, and stable pick and place machine, the LS08 SMT Pick and Place Machine from Applied Physics Semiconductor is your ideal solution. Designed for cost-effectiveness and intelligent automation, the LS08 is engineered to optimize your SMT production line—whether for LED, DOB, or general PCB assembly. Key Advantages:
- Automatic Nozzle Change (ANC): 20-hole nozzle library enables the system to automatically allocate and change nozzles based on component type, making SMT production smarter and more efficient.
- Universal High-Precision Mounting Head: One machine meets the mounting needs of a wide range of components with exceptional stability.
- Cast Iron Base Structure: Ensures smooth, vibration-free operation at high speeds.
- Dual Servo Motor Drive: Guarantees mounting accuracy and long-term reliability.
- Advanced Vision System: High-definition IC camera and high-speed fly cameras for precise component recognition and placement verification.
Why Choose Applied Physics Semiconductor?
- Trusted by Industry Leaders: Serving customers across North America and globally.
- Comprehensive SMT Solutions: From pick and place machines to solder paste printers and reflow ovens, plus one-stop SMT services.
- Expert Technical Support: Professional after-sales service and technical guidance.
- Customizable Production Lines: Tailored solutions for your unique manufacturing needs.
- Fast Delivery: Most products ship within 15 days of order confirmation.
LS08 Technical Specifications
| Parameter | Specification |
| Dimensions | 1280mm (L) × 1580mm (W) × 1500mm (H) |
| Weight | 1400 kg |
| Power Supply | AC220V (50Hz, single phase), 3.5kW |
| Air Supply | 0.5 MPa ~ 0.7 MPa |
| Vacuum Generation | Built-in vacuum pump |
| Mounting Head Quantity | 8 |
| Optimal Mounting Speed | 35,000 components per hour (CPH) |
| Mounting Accuracy | (XY) ±0.035mm |
| Component Height | ≤20mm |
| Component Types Supported | 01005, 0201, 0402, 0603 up to 5050, SOT, SOP, QFP, QFN, BGA, resistors, capacitors, diodes, transistors, LEDs, ICs, etc. |
| PCB Thickness | 0.6mm ~ 3.5mm |
| PCB Size (Standard) | 450mm (L) × 350mm (W) |
| PCB Size (Optional) | 1200mm (L) × 350mm (W) |
| PCB Conveying | 3-section rail, automatic conveying, PCB support device |
| Nozzle Change | Automatic, 20-hole nozzle library |
| Control System | Built-in industrial computer (Windows 7), monitor, keyboard, mouse |
| Drive System | X & Y axes: servo motors (Y axis dual motors), S-curve acceleration |
| Transmission System | X & Y axes: ground screw and silent linear guides (Y axis dual screws) |
| Feeding System | 25 NXT 8mm standard feeder stacks (supports IC tray and stick feeder) |
| Vision System | 8 fly cameras (up to 16mm × 16mm components), 1 IC camera (up to 36mm × 36mm), 2 mark cameras |
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Intelligent Automation & Advanced Features
- Automatic Nozzle Change (ANC): The LS08’s 20-hole nozzle library allows for seamless, automated nozzle changes, boosting efficiency and reducing manual intervention.
- Universal Mounting Head: Supports a wide range of component sizes (0201–16mm x 16mm and larger), eliminating the need for head replacement.
- Dual Servo Motor Y-Axis Drive: Ensures high-speed stability and accuracy, minimizing wear and maximizing uptime.
- Robust Frame Structure: Integrally cast iron base and Y-axis gantry provide superior impact resistance and long-term durability.
- Advanced Vision System: High-definition IC camera and high-speed fly cameras enable real-time, high-precision component recognition and placement verification.
- Flexible Feeding Options: Electric feeders with ±0.03mm accuracy, vibration feeders for tubular components, and IC tray support for bulk and tray-fed components.
Complete SMT Line Integration
Applied Physics Semiconductor offers a full suite of SMT production equipment, including:
- PCB Loaders & Unloaders: Automated board handling for seamless line integration.
- Solder Paste Printers: High-precision paste application for reliable solder joints.
- SMT Conveyors: Efficient board transfer between line segments.
- AOI (Automatic Optical Inspection): High-speed, high-precision inspection for mounting and soldering defects.
- Reflow Ovens: 8-zone temperature control for optimal soldering profiles.
- Feeders: Tape, tube, and tray feeders for all packaging types.
Product relationship
Available Through Applied Physics
Applied Physics supplies and supports quotation of this product. Product branding and manufacturer information, where stated on the product page or supporting documentation, remain authoritative.
Applied Physics portfolio: Semiconductor
Catalog relationship: Available Through Applied Physics
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