[annasta_filters preset_id=1]

8 Zone Reflow Oven up 8 + Bottom 8 Computer-controlled SMT Production Line Equipment F840
8 Zone Reflow Oven up 8 + Bottom 8 Computer-controlled SMT Production Line Equipment F840 - Image 2
8 Zone Reflow Oven up 8 + Bottom 8 Computer-controlled SMT Production Line Equipment F840 - Image 3

8 Zone Reflow Oven up 8 + Bottom 8 Computer-controlled SMT Production Line Equipment F840

Category:

The Applied Physics Semiconductor F840 Series 8 Zone Reflow Oven is engineered for high-precision, high-throughput SMT (Surface Mount Technology) production lines. Designed to meet the rigorous demands of modern electronics manufacturing, this advanced reflow oven features 8 upper and 8 lower heating zones, computer-controlled temperature management, and robust construction for reliable, repeatable results. The F840 Series is ideal for lead-free soldering processes and is optimized for both performance and energy efficiency, making it a top choice for PCB assembly operations in the United States and beyond. 

 

Key Features 

  • 16 Independent Heating Zones: 8 upper and 8 lower zones for precise, uniform thermal profiles across the entire PCB. 
  • Advanced Forced Convection: Utilizes high-performance hot air circulation (Taiwan SAYA motors) for consistent temperature distribution and superior solder joint quality. 
  • Dual Cooling Zones: Equipped with 2 plasma DC fans for rapid, controlled cooling, minimizing thermal stress and ensuring optimal solder solidification. 
  • Wide PCB Compatibility: Supports PCB widths up to 400mm with a durable stainless steel mesh belt conveyor. 
  • Flexible Control Options: Choose between computer-controlled (F840-LF-C) and instrument-controlled (F840-LF) models to match your process requirements. 
  • Energy Efficient: Low power consumption (approx. 4–4.5KW during operation) and rapid warm-up time (15–20 minutes). 
  • Precision and Safety: ±2°C temperature control precision, real-time abnormal temperature alarms, and robust manual access for maintenance. 
  • US Market Ready: Designed to meet the highest standards for lead-free soldering and compliant with US industrial requirements. 

 

Applications 

  • High-volume SMT PCB assembly 
  • Lead-free soldering processes 
  • Automotive, industrial, and consumer electronics manufacturing 
  • OEM and contract manufacturing environments 

 

Technical Specifications 

Below is a comprehensive specification table for the Applied Physics Semiconductor F840 Series 8 Zone Reflow Oven: 

Specification  F840-LF-C (Computer-Controlled)  F840-LF (Instrument-Controlled) 
Heating Parts Parameters     
Number of Heating Zones  Up 8 + Bottom 8  Up 8 + Bottom 8 
Length of Heating Zones  2840 mm  2840 mm 
Heating Pattern  Up: Hot air; Bottom: Hot air (Forced convection, Taiwan SAYA motor)  Up: Hot air; Bottom: Hot air (Forced convection, Taiwan SAYA motor) 
Number of Cooling Zones  2 Plasma DC Fan  2 Plasma DC Fan 
Conveyor Parts Parameters     
Max. Width of PCB  400 mm (stainless steel mesh belt)  400 mm (stainless steel mesh belt) 
Conveyor Direction  L → R  L → R 
Conveyor Height  880 ± 20 mm  880 ± 20 mm 
Transport Mode  Mesh Belt  Mesh Belt 
Conveyor Speed Range  0–2200 mm/min  0–2200 mm/min 
Control Parts Parameters     
Power Supply  5 Wire, 3 Phase, 380V 50/60Hz  5 Wire, 3 Phase, 380V 50/60Hz 
Start Power  30 KW  30 KW 
Power Consumption  Approx. 4–4.5 KW  Approx. 4–4.5 KW 
Warming Time  Approx. 15–20 mins  Approx. 15–20 mins 
Temp. Setting Range  Room Temp. – 380°C  Room Temp. – 380°C 
Temperature Control Method  Computer-controlled  Instrument-controlled 
Temperature Difference Between Adjacent Zones  70°C (supports the highest lead-free standards)  70°C (supports the highest lead-free standards) 
Temperature Control Precision  ±2°C  ±2°C 
Temperature Deviation on PCB  ±2°C  ±2°C 
Abnormal Alarm  Temperature abnormal (too high or too low after constant temperature keeping)  Temperature abnormal (too high or too low after constant temperature keeping) 
Open Way  Manual  Manual 
General Parameters     
Dimension (L × W × H)  4250 × 760 × 1450 mm  4250 × 760 × 1450 mm 
Weight  Approx. 500 kg  Approx. 500 kg 

Export as CSV 

 

Why Choose the F840 Series from Applied Physics Semiconductor? 

  • Precision Engineering: Achieve consistent, high-quality solder joints with advanced temperature control and uniform heating. 
  • Process Flexibility: Adaptable for a wide range of PCB sizes and assembly requirements. 
  • Reliability: Built for demanding production environments with robust construction and proven components. 
  • US-Based Support: Backed by Applied Physics Semiconductor’s commitment to customer service, technical support, and rapid response for North American clients. 
  • Compliance and Safety: Designed to meet or exceed US and international standards for lead-free and high-reliability electronics manufacturing.

Related products