PSL Wafer Standards and Silica Particle Wafer Standards are produced with a Particle Deposition System, which will first analyze a PSL size peak or silica size peak with a Differential Mobility Analyzer (DMA). A DMA is a highly accurate particle scanning tool, combined with condensation particle counter and computer control to isolate a highly accurate size peak, based on NIST Traceable particle size calibration. Once the size peak is verified, the particle size stream is directed to the prime silicon, wafer standard surface; counted as it is deposited in a full deposition across the wafer, or as a spot deposition at specific locations around the wafer. Wafer standards are highly accurate in particle size for calibration of KLA-Tencor Surfscan SP1, KLA-Tencor Surfscan SP2, KLA-Tencor Surfscan SP3, KLA-Tencor Surfscan SP5, Surfscan SPx, Tencor 6420, Tencor 6220, Tencor 6200, ADE, Hitachi and Topcon SSIS tools and wafer inspection systems. – The 2300 XP1 Particle Deposition System can deposit on 150mm, 200mm and 300mm wafers using PSL Spheres or silica particles from 30nm to 2um.
Differential Mobility Analyzer, DMA Voltage scan, Silica Size Peak, 100nm
PSL Spheres size standards and silica size standards are scanned by a differential mobility analyzer to determine true size peak. Once the size peak is analyzed, then the wafer standard can be deposited as a full deposition or a spot deposition, or a multiple spot deposition wafer standards. Silica size peak at 100 nano meters (0.1 microns) is scanned above and the DMA detects a true silica size peak at 101nm.