AP PC6635 Fully Computer Controlled Lead-free Reflow Oven Cost-Effective Lead Free With Custom-Made Track
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AP PC6635 Fully Computer Controlled Lead-free Reflow Oven Cost-Effective Lead Free With Custom-Made Track

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Description

The Applied Physics Semiconductor PC6635 is a fully computer-controlled, cost-effective lead-free reflow oven designed for high-precision SMT production. Featuring custom-made track, advanced industrial computer control, and robust safety features, the PC6635 is engineered for reliability, energy efficiency, and ease of use. This oven is ideal for electronics manufacturers seeking a high-performance solution for lead-free soldering processes in the US market. 

 

Key Features 

  • 12 Heating Zones: 6 upper and 6 lower zones for precise, uniform heating. 
  • Dual Cooling Zones: Ensures rapid and controlled cooling for optimal solder joints. 
  • Customizable Conveyor: Mesh belt width up to 350mm, with adjustable guide rail to 250mm. 
  • Industrial Computer Control: Includes a Dell monitor, Siemens PLC, and Windows 10 interface for seamless operation and data management. 
  • Energy Efficient: Innovative heating sequence and independent zone shutdown save up to 1/3 of energy or time. 
  • Comprehensive Safety: Abnormal temperature alarms, optional board drop alarms, and leakage protection. 
  • Data Logging: Automatic recording of machine status, temperature curves, and alarm history for up to one year. 
  • User-Friendly Maintenance: Detachable door structure for maximum access and easy servicing. 
  • High Reliability: All components are imported for maximum durability and performance. 

 

Technical Specifications 

Parameter  Specification 
Heating Part   
Number of Heating Zones  Upper 6 / Lower 6 
Heating Length  2200 mm 
Number of Cooling Zones  2 
Conveyor   
Max. PCB Width  Mesh belt: 350 mm; Guide rail adjustable: 250 mm 
Conveyor Direction  L→R (R→L optional) 
Conveyor Height  Mesh belt: 880 ± 20 mm 
Transport System  Mesh belt + guide rail transmission 
Conveyor Speed  0–2000 mm/min 
Control   
Power Supply  5 wires, 3 phases, 380V 50/60Hz 
Start-up Power  24 KW 
Operating Power Consumption  Approx. 5–6 KW 
Control System  Industrial computer + Dell monitor 
Warm-up Time  About 20 minutes 
Temperature Control Range  Room temperature – 350℃ 
Temperature Control Method  Industrial computer + temperature control module, SSR driver 
Temperature Control Precision  ±1℃ 
Temperature Distribution Error  ±3℃ 
Trouble Alarm  Abnormal temperature (super high/low after constant temperature) 
Board Drop Alarm  Optional 
Machine Size & Weight   
Weight  Approx. 400 kg 
Dimensions (L×W×H)  3600 × 700 × 1430 mm 
Heating Characteristics   
Heating Sequence  Raises the temperature from the middle to both sides, saving 1/3 energy/time 
Temperature Curve Conversion Time  <15 min (for temperature adjustment <100℃) 
Heating Zone Temperature Control Accuracy  ±1℃ 
Temperature Deviation Within Substrate  ±2℃ 
No Load → Full Load Thermal Balance Recovery  ≤25 seconds 
Independent Zone Shutdown  Each zone can be turned off independently via the computer 
Heating Element  Hot air motor (imported, 2800 rpm), long-life winding heater 
Air Duct Structure  Efficient, high-volume circulating air 
Machine Structure   
Frame  Welded, sturdy, and durable 
Door  Detachable for maximum maintenance space 
Electrical & Control Performance   
Control Host  Industrial computer + Siemens PLC 
Interface  Windows 10, Chinese/English switchable 
Safety  Leakage protector, temperature alarms 
Reliability  All imported components 
Data & Monitoring   
Status Recording  Automatic, per zone and part, saved for 1 year 
Temperature Curve Chart  Daily files, view and analyze trends 
Production Database  Generates PCB production reports by board number 
Alarm List  All alarms are saved with time stamps 
Temperature Curve Test  Standard 3-point configuration, curve analysis 

Export as CSV 

 

Advanced Features 

  • Energy-Saving Heating Sequence: Temperature is raised sequentially from the center outward, reducing energy consumption and warm-up time. 
  • Independent Zone Control: Each heating zone can be independently shut down, allowing for custom thermal profiles and energy savings. 
  • Comprehensive Data Management: Automatic logging of all machine operations, temperature curves, and alarms for traceability and process optimization. 
  • User-Friendly Interface: Genuine Windows 10 OS with easy switching between Chinese and English, suitable for diverse production teams. 
  • Maintenance-Friendly Design: Detachable doors and a robust welded frame for easy access and long-term durability. 

 

Applications 

  • High-precision SMT assembly lines 
  • Lead-free soldering for automotive, industrial, and consumer electronics 
  • Contract manufacturing and OEM production environments 

 

Why Choose the PC6635 from Applied Physics Semiconductor? 

  • Precision and Reliability: Achieve consistent, high-quality solder joints with advanced temperature control and uniform heating. 
  • Energy Efficiency: Innovative heating and control strategies reduce operational costs. 
  • Comprehensive Safety and Monitoring: Protect your investment and ensure process traceability with advanced alarms and data logging. 
  • US-Based Support: Applied Physics Semiconductor provides expert support and service for North American customers. 
  • SEO Optimized: Designed for maximum visibility for terms like “lead-free reflow oven,” “computer-controlled SMT reflow,” and “custom track reflow oven USA.”

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