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Automatic SMT Solder Paste Printing Machine SMT Printer SMT Stencil Printer Production Line
The Applied Physics Semiconductor Automatic SMT Solder Paste Printing Machine is engineered for high-precision, high-throughput PCB assembly lines. Designed to meet the rigorous demands of modern electronics manufacturing, this advanced SMT stencil printer integrates intelligent automation, real-time process control, and closed-loop feedback to ensure exceptional print quality, yield, and operational efficiency.
Ideal for applications in consumer electronics, automotive, aerospace, and medical device manufacturing; this system delivers consistent, repeatable results for both high-mix/low-volume and high-volume production environments.
Key Features & Benefits
- Closed-Loop SPI Integration:
Seamlessly integrates with inline Solder Paste Inspection (SPI) systems to form a closed-loop feedback mechanism. Upon receiving SPI feedback indicating print deviations, the printer automatically adjusts X and Y alignment and initiates stencil cleaning, ensuring optimal print quality and minimizing defects.
- Automatic Solder Paste Supply:
Real-time monitoring of solder paste roll diameter on the user interface triggers automatic paste replenishment, maintaining consistent paste volume and reducing manual intervention.
- Solder Paste Residue Monitoring:
Equipped with a solder paste inspection sensor positioned before the squeegee, the system intelligently monitors the remaining solder paste on the stencil and prompts operators when additional paste is required, preventing insufficient paste conditions.
- Intelligent Cleaning System:
Supports various wipe paper sizes with optimized solvent control, reducing paper consumption and ensuring thorough stencil cleaning for consistent print results.
- Precision Engineering:
Achieves industry-leading print and repeat position accuracy, supported by a robust, one-piece welded frame and advanced motion control architecture.
- Flexible Operation:
Compatible with a wide range of screen frame sizes and thicknesses, and supports multiple paste types including solder paste, printing ink, and silver paste.
Technical Specifications
| Specification | Value/Description |
| Printing Accuracy | >2Cpk @ ±25μm, 6σ |
| Repeat Position Accuracy | >2Cpk @ ±10μm, 6σ |
| Cycle Time | 7 seconds |
| Maximum Print Area | 400mm (X) × 340mm (Y) |
| Screen Frame Size | 470mm × 370mm ~ 737mm × 737mm |
| Screen Frame Thickness | 25mm – 40mm |
| Print Pressure | 0kg – 10kg |
| Print Speed | 1mm/sec – 200mm/sec |
| Print Gap | 0mm – 20mm |
| Substrate Separation | 0.1 – 20mm/s (Speed), 0mm – 3mm (Distance) |
| Separation Options | Separation after squeegee up; Squeegee up after separation |
| Paste Compatibility | Solder paste, printing ink, silver paste |
| Printer Construction | One-piece optimized welded frame |
| Machine Control | Three-axis motion control card |
| Operating System | Windows XP, Windows 7 (option) |
| Operator Interface | 17" DELL display, keyboard, mouse, DESEN V2 software (right-hand display) |
| Squeegee System | Direct screw/single-point suspension squeegee |
| Squeegee Pressure Control | Software-adjusted, constant intelligent control |
| Stencil Positioning | Automatic positioning module; squeegee auto-aligns stencil in support frame |
| Support Positioning System | Support block, support pin, support platform |
| Cleaning System | Supports various wipe paper sizes, solvent agent control module |
Advanced Process Control
- Closed-Loop Feedback:
The system’s closed-loop SPI integration enables real-time process optimization. When SPI detects a print defect, the printer automatically corrects X/Y deviations and initiates stencil cleaning, significantly improving first-pass yield and reducing rework .
- Automated Material Management:
Intelligent sensors monitor solder paste levels both on the stencil and in the supply roll, ensuring uninterrupted production and consistent paste deposition.
Why Choose Applied Physics Semiconductor?
- Technical Leadership:
State-of-the-art automation, process control, and integration with Industry 4.0 manufacturing environments.
- Reliability:
Engineered for high-yield, defect-free production with robust construction and intelligent process monitoring.
- Customer Focus:
Dedicated support, training, and application engineering to ensure your success.
