SMT-Pick and Place Machine-CHM-551

Description

If your operation demands a high-speed, high-precision, and stable pick-and-place solution, the APS-551 from Applied Physics Semiconductor is engineered to exceed expectations. Designed for both performance and cost-effectiveness, the APS-551 is the ideal choice for companies seeking a robust, scalable, and intelligent SMT (Surface Mount Technology) production line. Applied Physics Semiconductor delivers not just equipment, but comprehensive SMT solutions tailored to your unique manufacturing needs.

Company Profile

Applied Physics Semiconductor is a leading innovator in the field of SMT automation, with over 15 years of experience in the research, development, manufacturing, and global distribution of advanced pick-and-place machines. Our state-of-the-art industrial campus spans nearly 40,000 square meters and houses dedicated R&D, manufacturing, and sales centers.

Our products are trusted by electronics manufacturers in over 30 countries, and we are recognized for our commitment to technical excellence, customer-centric solutions, and reliable after-sales support.

Why Choose Applied Physics Semiconductor?

Global Trust: Chosen by customers in more than 30 countries worldwide.
Custom Solutions: Extensive experience in designing and implementing SMT factory setups, with the ability to customize solutions from the ground up.
Technical Expertise: Access to professional technical services and ongoing support.
Problem Solvers: Deep experience in addressing and resolving SMT production challenges.
Reliable Partnership: A proven, dependable partner for your electronics manufacturing needs.

APS-551 High-Precision 4-Head SMT Pick and Place Machine: Key Features

Process Capability (CPK): The APS-551 is engineered to deliver stable and accurate performance, with a CPK (Process Capability Index) ≥1.0, ensuring consistent placement accuracy within required tolerances.
Automatic Nozzle Change (ANC): Features a 13-position nozzle library for automatic nozzle changes, enabling seamless adaptation to different component types and boosting production efficiency.
Four Simultaneous Mounting Heads: Four independent heads pick up components concurrently, significantly reducing cycle time and increasing throughput.
Universal Multifunctional Mounting Head: Capable of handling a wide range of components (0201 to 36mm x 36mm) without the need to change the mounting head.
Advanced Vision Systems:
High-Definition IC Camera: Utilizes advanced visual algorithms for precise pin identification and segmentation, ensuring accurate placement of both small and large components.
High-Speed Flying Camera: Synchronously recognizes components up to 16mm x 16mm, with each nozzle featuring independent detection for enhanced reliability.
Feeder System: Supports up to 50 feeder positions (8mm), with 25 material stacks at both the front and rear. Compatible with Yamaha feeders, offering ±0.03mm feeding accuracy and high-speed operation to minimize material loss.
Flexible Feeding Options: Supports electric/pneumatic feeders, vibration feeders for tubular components, and IC tray/bulk component feeding.
Robust Build and Automation: Incorporates servo-driven X&Y axes with S-curve acceleration/deceleration, ball screw and linear guide transmission, and an automatic transfer rail system for smooth PCB handling.
User-Friendly Control: Built-in industrial computer running a Linux operating system, complete with monitor, keyboard, and mouse for intuitive operation.

Technical Specifications

Below is a comprehensive table summarizing the key specifications of the APS-551 High-Precision 4-Head SMT Pick and Place Machine:

Specification	Details
Model	APS-551
Dimensions	1050mm (L) × 1050mm (W) × 885mm (H)
Weight	190 kg
Power Supply	AC220V (50Hz, single phase), 600W
Air Supply	0.5 MPa ~ 0.7 MPa
Vacuum Generation	Vacuum generator (Japan PISCO)
Mounting Head Quantity	4
Mounting Speed	11,500 CPH (optimal); IPC-9850 speed: 8,850 CPH
Mounting Accuracy	±60μm, CPK ≥1.0 (XY)
Control Accuracy	5μm
Component Height	Up to 12mm
Component Type	0201/0402/0603–5050/SOT/SOP/QFP/QFN/BGA, etc. (resistor, capacitor, diode, LED, IC, etc.)
PCB Thickness	0.6mm ~ 3.5mm
PCB Size (Standard)	350mm (L) × 270mm (W)
PCB Size (Optional)	600mm (L) × 270mm (W)
Nozzle Change	Automatic (13-position nozzle library)
Control System	Built-in industrial computer (Linux OS), monitor, keyboard, mouse
Drive System	X&Y axes driven by servo motors, S-curve acceleration/deceleration
Transmission System	Ball screw + linear guide, automatic transfer rail system
Feeding System	50 Yamaha 8mm standard pneumatic/electric feeder stacks; supports IC tray and stick feeder
Vision System	Snapshot camera ×4 (up to 14mm × 14mm); IC camera ×1 (up to 36mm × 36mm); Mark camera ×2
Fly Camera	6 (up to 16mm × 16mm); IC camera ×1 (up to 36mm × 36mm); Mark camera ×2

Applied Physics Semiconductor Advantage

Industry-Leading Technology: Our pick and place machines are designed for high-speed, high-precision, and stable operation, meeting the rigorous demands of modern electronics manufacturing.
Comprehensive Support: From initial consultation to after-sales service, our team is dedicated to your success.