Applied Physics · Precision technologies since 1992
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In today’s semiconductor metrology labs, the wafer inspection tools, use high powered lasers to scan 200 mm and 300 mm silicon wafers to detect surface particles down to < 30 nanometers. When calibrating high laser power scanning systems, the size calibration is extremely important, in order to detect at 30 nm; and to accurately size particles across the size range. The size calibration using high powered lasers and traditional polystyrene latex sphere for calibrations may be difficult, as high laser power can shrivel the latex spheres. The solution is using silica particle, size standards at 20 nm, 30 nm, 50 nm, 100 nm, 500 nm, 1 µm and 2 µm. The advantage is that silica will not shrivel under the high laser power, thus consistently providing an accurate size peak for calibration; and the silica particles have a very close refractive index as compared to polystyrene latex particles. Silica Contamination Wafer Standards; Silica Particle Size Standards
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Continue from particle science to the correct standard or material
Choose the commercial path from application, material, nominal size, form/concentration and documentation requirement rather than jumping to an arbitrary SKU.
PARTICLE REFERENCE PATH
Loose silica standards support particle and research workflows. A contamination wafer adds substrate, deposition geometry and an inspection objective.
APPLIED PHYSICS TECHNICAL RESOURCE
Wafer inspection, SSIS calibration, particle deposition references, process control and semiconductor measurement workflows. Product and standards references should be interpreted for the actual instrument, facility, protocol and configuration.
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